Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.24.4	DMA	℃	200
Tg			TMA	℃	170
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	350
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	45
			After Tg	ppm/℃	210
			50-260℃	%	2.3
T260		IPC-TM-650 2.4.24.1	TMA	min	>60
T288		IPC-TM-650 2.4.24.1	TMA	min	45
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	s	>100
Volume Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ.cm	2.51E+08
			E-24/125	MΩ.cm	1.88E+06
Surface Resistivity		IPC-TM-650 2.5.17.1	After moisture resistance	MΩ	3.29E+07
			E-24/125	MΩ	2.38E+06
Arc Resistance		IPC-TM-650 2.5.1	D-48/50+D-4/23	s	146
Dielectric Breakdown		IPC-TM-650 2.5.6	D-48/50+D-4/23	kV	>45
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1GHz	--	4.6
		IPC-TM-650 2.5.5.9	1MHz	--	4.8
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1GHz	--	0.015
		IPC-TM-650 2.5.5.9	1MHz	--	0.009
Peel Strength (1oz HTE copper foil)		IPC-TM-650 2.4.8	A	N/mm	—
			After thermal Stress 288℃,10s	N/mm	1.25 [7.14]
			125℃	N/mm	—
Flexural Strength	LW	IPC-TM-650 2.4.4	A	MPa	530
	CW	IPC-TM-650 2.4.4	A	MPa	410
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.07
CTI		IEC60112	A	Rating	PLC 3
Flammability		UL94	C-48/23/50	Rating	V-0
			E-24/125	Rating	V-0

Remarks:

1. Specification sheet: IPC-4101/126, is for your reference only.

2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.