Items	Method	Condition	Unit	Typical Value
Tg	2.4.24.4	DMA	℃	190
	2.4.25D	DSC		175
Td	2.4.24.6	5% wt. loss	℃	402
T288	2.4.24.1	TMA	min	60
T260	2.4.24.1	TMA	min	60
Thermal Stress	2.4.13.1	288℃, solder dip	-	>100s No Delamination
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	35
		After Tg	ppm/℃	190
		50-260℃	%	2.2
Dissipation Constant (1GHz)	2.5.5.9	C-24/23/50	-	4.3
Dissipation Factor (1GHz)	2.5.5.9	C-24/23/50	-	0.015
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ.cm	4.83×107
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	4.98×106
Arc Resistance	2.5.1	D-48/50+D-0.5/23	s	130
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	45+kV NB
Peel Strength (1Oz)	2.4.8	288℃/10s	N/mm	1.3 [7.43]
Flexural Strength (LW/CW)	2.4.4	A	MPa	520/400
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.09
Flammability	UL94	C-48/23/50	Rating	V-0
CTI	IEC60112	A	Rating	PLC0

Remarks:

Remark:

1. Specificationsheet: IPC-4101/130, is for your reference only.

2. All the typicalvalue is based on the 1.6mm (8X7628) specimen, “ * ” is based on the1.0mm(9X2116) specimen.

3. Inorder to satisfy CTI≥600V,2116(RC≥54%)，7628(RC≥45%) or above thickness prepreg is suggestedto be used for outer prepreg layer. If you have any queries, please turn toShengyi Technology Co., Ltd for detailed information.

4. All the typicalvalue listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.