Items	Method	Condition	Unit	Typical Value
Tg	2.4.24.4	DMA	℃	165
	2.4.25D	DSC		156
Td	2.4.24.6	5% wt. loss	℃	353
T288	2.4.24.1	TMA	min	25
T260	2.4.24.1	TMA	min	>60
Thermal Stress	2.4.13.1	288℃, solder dip	-	>100
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	37
		After Tg	ppm/℃	210
		50-260℃	%	2.8
Permittivity (10GHz)	2.5.5.5	C-24/23/50	-	3.89
Loss Tangent (10GHz)	2.5.5.5	C-24/23/50	-	0.0145
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ/cm	2.7×108
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	4.2×107
Arc Resistance	2.5.1	D-48/50+D-0.5/23	s	150
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	>45
Peel Strength (1Oz)	2.4.8	288℃/10s	N/mm[lb/in]	1.25[7.15]
Flexural Strength(LW/CW)	2.4.4	A	MPa	542/488
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.09
Flammability	UL94	C-48/23/50	Rating	V-0
CTI	IEC60112	A	Rating	PLC3

Remarks:

1. All the typical value is based on the 1.6mm specimen. Test method is according to IPC-TM-650.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.