Product
SLF
Characteristic
●Excellent soldering reliability, dimensional stability and chemical resistance
●Low Dk/Df
●Excellent mechanical and electrical properties .
●Halogen free, Flammability UL94 VTM-0.
●Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE, etc..
Application Area
Computer, mobile phone, digital camera, VCR, flat panel display, apparatus and instrument, automotive electronics, etc..
- Product Performance
- Product Certificate
- Data Download
|
Test Item |
Test Method |
Unit |
IPC Standard |
Typical Value |
|
SLF 1012SS |
||||
|
Peel Strength 90° |
IPC-TM-650,No.2.4.9 Method A |
N/mm |
≥0.53 |
0.92 |
|
Surface adhesion (with pure adhesive) |
企标Q/GDSY 6058.26. 2.4.9.3 |
N/mm |
- |
0.54 |
|
Thermal Stress |
IPC-TM-650,No.2.4.13 |
- |
Pass |
Pass |
|
Dimensional Stability |
IPC-TM-650,No.2.2.4 Method B |
% |
±0.15 |
MD: -0.0682 TD: -0.0585 |
|
Chemical Resistance |
IPC-TM-650,No.2.3.2 |
% |
≥80 |
＞95 |
|
Moisture Absorption |
IPC-TM-650,No.2.6.2 |
% |
≤2 |
0.46 |
|
Volume Resistivity |
IPC-TM-650,No.2.5.17 |
MΩ-cm |
≥106 |
2.54×108 |
|
Surface Resistance |
IPC-TM-650,No.2.5.17 |
MΩ |
≥105 |
3.68×106 |
|
10GHZ Dielectric Constant |
IEC-61189-2-721 |
- |
≤3.8 |
3.2 |
|
10GHZ Dissipation Factor |
IEC-61189-2-721 |
- |
≤0.01 |
0.0032 |
|
MIT |
JIS C 6471 R0.38×4.9N |
Times |
- |
＞200 |
|
Dielectric Strength |
IPC-TM-650,No.2.5.6.1 |
V/μm |
≥100 |
187 |
Remarks:
Explanations: Certified to IPC-4204/25 Copper Clad Adhesiveless,Cast and Cured Polyimide