Items	Method	Condition	Unit	Typical Value
Tg	2.4.24.4	DMA	℃	185
	2.4.25D	DSC		175
Td	2.4.24.6	5% wt. loss	℃	405
T288	2.4.24.1	TMA	min	≥60
T260	2.4.24.1	TMA	min	≥60
Thermal Stress	2.4.13.1	288℃, solder dip	-	PASS
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	45
		After Tg	ppm/℃	245
		50-260℃	%	2.5
Dissipation Constant	2.5.5.9 (1GHz)	C-24/23/50	-	3.90
	2.5.5.5(10GHz)	C-24/23/50	-	3.72
	SPDR(10GHz)	C-24/23/50	-	4.06
Dissipation Factor	2.5.5.9 (1GHz)	C-24/23/50	-	0.0070
	2.5.5.5(10GHz)	C-24/23/50	-	0.0089
	SPDR(10GHz)	C-24/23/50	-	0.0100
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ/cm	7.0×107
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	9.0×107
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	＞45
Peel Strength (1Oz)	2.4.8	288℃/10s	N/mm	0.85 [4.86]
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.12
Flammability	UL94	C-48/23/50	Rating	V-0(HF)

Remarks:

1. All the typical value is based on the 0.76mm (6*2116) specimen.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.