EN/CN

Product

S7439G

Characteristic

● Tg 189℃ (DMA)
● Dk/Df@10GHz: 3.74/0.0060
● Td>400℃, T300>60min

● low Z-axis CTE with good processibility

● Low moisture absorption and excellent thermal reliability

● Lead-free Compatible

Application Area

● Networking equipment (Routers, servers, switches)

● High performance computers

● Base Station backplane, line card

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4
DMA
189
IPC-TM-650 2.4.25D
DSC
181
Td IPC-TM-650 2.4.24.6 5% wt. loss 405
T288 IPC-TM-650 2.4.24.1
TMA
min 60
T300 IPC-TM-650 2.4.24.1
TMA min 60
Thermal Stress IPC-TM-650 2.4.13.1
288℃, solder dip s 100
CTE(Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 225
50-260℃ % 2.5

Dissipation Constant (Dk)

IPC-TM-650 2.5.5.9 1GHz -- 3.93
IPC-TM-650 2.5.5.5 10GHz -- 3.74
IEC 61189-2-721
10GHz -- 4.08

Dissipation Factor (Df)

IPC-TM-650 2.5.5.9 1GHz -- 0.0043

IPC-TM-650 2.5.5.5 10GHz -- 0.0060

IEC 61189-2-721
10GHz -- 0.0070
Volume Resistivity IPC-TM-650 2.5.17.1
C-96/35/90
MΩ-cm 9.0×108
Surface Resistivity IPC-TM-650 2.5.17.1
C-96/35/90
2.0×107
Peel Strength (1Oz RTF copper foil) IPC-TM-650 2.4.8 After thermal Stress 288℃,10s
N/mm [lb/in] 0.90 [7.0]
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.12
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Remarks:

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.