Product
Synamic 6
Characteristic
● Tg 205℃ (DMA)● Low Dk/Df
● Td＞400℃, T300＞60min
● Low Z-axis CTE with good PCB processibility
● Low moisture absorption and excellent thermal reliability
● Lead-free compatible
Application Area
● Server, switch, storage, routers and base station BBU...
● Optical networking products
● high frequency application
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 205 |
| 2.4.25D |
DSC |
185 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 402 |
|
T288 |
2.4.24.1 | TMA | min | 120 |
| T300 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 50 |
| After Tg | ppm/℃ | 210 | ||
| 50-260℃ | % | 2.0 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.70 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.68 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.99 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0021 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0036 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0046 | |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.85 [4.86] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
1.All the typical value is based on 0.76mm（6*2116）thickness specimen.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi TechnologyCo., Ltd.
E Remarks: C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning.
T The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.