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S1125

特点

●  不含卤素,Dicy 固化 普通Tg 。

●  不含锑、红磷等成分。

●  优异的表面粘结性。

应用领域

手机、电脑、仪器仪表、摄录机、通讯设备等
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Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 130
Td IPC-TM-650 2.4.24.6 5% wt. loss 350
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 40
After Tg
ppm/℃ 235
50-260℃ %
3
T288 IPC-TM-650 2.4.24.1 TMA min 30
Thermal Stress IPC-TM-650 2.4.24.13 288℃, solder dip -- >100S
Flexural strength IPC-TM-650 2.4.4
A Mpa
580/LW
A Mpa
450/CW
Peel Strength IPC-TM-650 2.4.8 Copper (1/2 oz) N/mm 1.2
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
Flammability UL94 E-24/125
Rating V-0

Remarks:

1. Performance data based on the sample S1125 0.30mm test results.

2.The test method of PS: superposition the ED copper foil (1Oz),bonding film, S1125, then  laminate them, using the pararmeters 170℃, 200PSI, 40 minutes. Using 90 degree angle peelling.

3. All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.