Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	180
Tg		IPC-TM-650 2.4.24.4	DMA	℃	190
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	415
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	35
			After Tg	ppm/℃	245
			50-260℃	%	2.3
T260		IPC-TM-650 2.4.24.1	TMA	min	≥60
T288		IPC-TM-650 2.4.24.1	TMA	min	≥60
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	PASS
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1GHz	--	4.15
		IPC-TM-650 2.5.5.5	10GHz	--	3.95
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1GHz	--	0.0080
		IPC-TM-650 2.5.5.5	10GHz	--	0.0095
Peel Strength (1oz copper foil)		After thermal Stress 288℃,10s	N/mm	1.0
Water Absorption		IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.12
Flammability		UL94	C-48/23/50	Rating	V-0

Remarks:

Remarks:

1.       Meet IPC-4101/130 specification sheet.

2.       All the typical value is based on the 0.76mm (6*2116)specimen, but not guarantee data.

3.       All the typical values listed above are for yourreference only and not intended for specification. Please contact ShengyiTechnology Co., Ltd. for detailed information. All rights from this data sheetare reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning,D=Immersion conditioning in distilled water, E=Temperature conditioning. Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.