Items	Method	Condition	Unit	Typical Value
Tg	2.4.24.4	DMA	℃	175
Td	2.4.24.6	5% wt. loss	℃	348
T288	2.4.24.1	TMA	min	20
T260	2.4.24.1	TMA	min	60
Thermal Stress	2.4.13.1	288℃, solder dip	-	＞60s No Delamination
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	56
		After Tg	ppm/℃	326
		50-260℃	%	3.8
Dissipation Constant (1GHz)	2.5.5.9	C-24/23/50	-	3.6
Dissipation Factor (1GHz)	2.5.5.9	C-24/23/50	-	0.0164
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ.cm	4.6 x 106
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	7.9 x 105
Arc Resistance	2.5.1	D-48/50+D-0.5/23	s	90
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	45+kV NB
Peel Strength (1oz)	2.4.8	288℃/10s	N/mm	1.3
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.20
Flammability	UL94	C-48/23/50	Rating	V-0
CTI	IEC60112	A	Rating	PLC3

Remarks:

1. Specimen thickness: 1.8mm. Test method is according to IPC-TM-650.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.