产品与市场
S1000H
特点
● 耐CAF
● 无铅兼容
● 优良的耐热性
● 优良的通孔可靠性
● 较低吸水率
应用领域
● 电脑和笔记本电脑
● 仪器仪表
● 消费电子
● 汽车电子
● 电源和工业仪器
- 产品性能
- 产品证书
- 资料下载
Items | Method | Condition | Unit | Typical Value | |
---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.25D | DSC | ℃ | 155 | |
IPC-TM-650 2.4.24.4 | DMA | ℃ | 160 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 348 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 37 | |
After Tg | ppm/℃ | 230 | |||
50-260℃ | % | 2.8 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 1.5E + 08 | |
E-24/125 | MΩ.cm | 3.2E + 06 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 3.5E + 07 | |
E-24/125 | MΩ | 2.3E + 06 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 150 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | >45 | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.6 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.011 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength (1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm[lb/in] | 1.3[7.43] | |||
125℃ | N/mm | — | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 530 |
CW | IPC-TM-650 2.4.4 | A | MPa | 440 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 | |
CTI | IEC60112 | A | Rating | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Remarks:
1. Specification sheet: IPC-4101/99, is for your reference only.
2. All the typical value is based on the 1.6mm(8*7628) specimen.
3. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights fromthis data sheet are reserved by Shengyi Technology Co., Ltd.