Items	Method	Condition	Unit	Typical Value
Thermal Conductivity	ASTM-D5470	A	W/ (m•K)	1.0
Tg	2.4.25D	DMA	℃	175
Td	2.4.24.6	Wt 5% loss	℃	400
Thermal Stress	2.4.13.1	288℃, solder float	s	300
T288	2.4.24.1	TMA	min	60
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	27
		After Tg	ppm/℃	176
		50-260℃	%	1.8
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ/cm	1.4x109
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	1.5x107
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	>45
Peel Strength (1oz HTE)	2.4.8	288℃/10s	N/mm	1.15
Flammability	UL94	C-48/23/50	Rating	V-0
Water Absorption	IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.10

Remarks:

1. All the typical value is based onthe 0.5mm specimen(5x106). The Value of water absorption andCTE(Z-axis) is based on the 2.0mm（15x2116）.

2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letterindicates the duration of preconditioning in hours, the second digit thepreconditioning temperature in ℃ and the third digit the relativehumidity.