Items	Method	Condition	Unit	Typical Value
Thermal Conductivity	ASTM-D5470	A	W/ (m•K)	1.6
	ASTM E1461	A		2.0
Tg	2.4.25D	DSC	℃	170
Td	2.4.24.6	Wt 5% loss	℃	410
Thermal Stress	2.4.13.1	288℃, solder float	min	>30
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	37
		After Tg	ppm/℃	166
		50-260℃	%	2.2
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ/cm	108
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	107
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	>45
Peel Strength (1oz)	2.4.8	288℃/10s	N/mm	1.05
Flammability	UL94	C-48/23/50	Rating	V-0
Water Absorption	IPC-TM-650 2.6.2.1	E-1/105+D-24/23	%	0.11
CTI	IEC60112	A	Rating	PLC0

Remarks:

Remarks:

1. All the typical value is based onthe 1.0mm specimen, while the Tg is for specimen≥0.50mm.

2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.