Items		Method	Condition	Unit	Typical Value
Tg		IPC-TM-650 2.4.25	DSC	℃	190
Tg		IPC-TM-650 2.4.24.4	DMA	℃	200
Td		IPC-TM-650 2.4.24.6	5% wt. loss	℃	383
CTE (Z-axis)		IPC-TM-650 2.4.24	Before Tg	ppm/℃	45
			After Tg	ppm/℃	210
			50-260℃	%	2.6
T300		IPC-TM-650 2.4.24.1	TMA	min	60
T288		IPC-TM-650 2.4.24.1	TMA	min	120
Thermal Stress		IPC-TM-650 2.4.13.1	288℃, solder dip	--	PASS
Dissipation Constant (Dk)		IPC-TM-650 2.5.5.9	1GHz	--	3.85
		IPC-TM-6502.5.5.5	10GHz	--	3.66
		IEC 61189-2-721	10GHz	--	4.05
Dissipation Factor (Df)		IPC-TM-650 2.5.5.9	1GHz	--	0.0045
		IPC-TM-6502.5.5.5	10GHz	--	0.0060
		IEC 61189-2-721	10GHz	--	0.0068
Volume Resistivity		2.5.17.1	After moisture resistance	MΩ.cm	4.03×107
Surface Resistivity		2.5.17.1	After moisture resistance	MΩ	2.03×107
Arc Resistance		2.5.1	D-48/50+D-0.5/23	s	180
Dielectric Breakdown		2.5.6	D-48/50+D-0.5/23	kV	＞45
Peel Strength (1oz RTF copper foil)		2.4.8	After thermal Stress 288℃,10s	N/mm [lb/in]	0.95 [5.43]
Water Absorption		2.6.2.1	E-1/105+D-24/23	%	0.09
Flammability		UL94	C-48/23/50, E-24/125	Rating	V-0

Remarks:

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.