Items	Method	Condition	Unit	Typical Value
Tg	2.4.25	TMA	℃	190
	2.4.24.2	DMA		225
Peel Strength	2.4.8	Copper Foil（1/3oz）	N/mm	0.7
	2.4.8	Copper Foil（1/2oz）	N/mm	1.0
	2.4.9	CVL	N/mm	1.0
T300	2.4.24.1	TMA	min	＞30
Td	2.4.24.6	TGA(5% wt. loss)	℃	410
Thermal Stress	-	288℃, solder dip	s	>600
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.26
CTE (Z-axis)	2.4.24	TMA (before Tg)	ppm/℃	34
		TMA (After Tg)	ppm/℃	115
Dielectric Constant (RC67%@1GHz)	2.5.5.9	C-24/23/50	-	4.21
Dissipation Factor(RC67%@1GHz)	2.5.5.9	C-24/23/50	-	0.015
Flammability	UL94	C-48/23/50	Rating	V-0

Remarks:

Remarks: Specimen thickness: 0.8mm. Alltypical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information.

Explanations: C=Humidity conditioning;D=Immersion conditioning in distilled water; E=temperature conditioning.

All the typical value listed above is foryour reference only, please turn to Shengyi Technology Co., Ltd. for detailedinformation, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.