EN/CN

Product

SP175M

Characteristic

● Lead free compatible
● Excellent thermal reliability
● Low Z-axis CTE
● Low water absorption

Application Area

● Suitable for high aspect ratio and high-layer PCB.

● Widely used in computer, communication equipment, precise apparatus and instrument, router and etc.

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.2 DMA 175
Td 2.4.24.6 5% wt. loss 348
T288
2.4.24.1 TMA min 20
T260 2.4.24.1
TMA min
60
Thermal Stress
2.4.24.13
288℃, solder dip
- >60s No Delamination
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 56
After Tg ppm/℃ 326
50-260℃ % 3.8
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 -

3.6

Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.0164
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ/cm 4.6 x 106
Surface Resistivity
2.5.17.1
C-96/35/90 7.9 x 105
Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 90
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 45+KV NB
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 1.3
Water Absorption 2.6.2.1 D-24/23 % 0.20
Flammability
UL94
C-48/23/50
Rating
V-0
CTI IEC60112 A Rating PLC3

Remarks:

1. Specimen thickness: 1.8mm. Test method is according to IPC-TM-650.

2. All the typical values listed above are for your reference only. Please turn to Shengyi Technology Co., Ltd. for more detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.

3. Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.


No Record