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Items Method Condition Unit Typical Value
Tg IPC-TM-650 DSC 160

Td IPC-TM-650 5% wt. loss 400
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 35
After Tg ppm/℃ 189
50-260℃ % 2.3
T260 IPC-TM-650 TMA min 60
T288 IPC-TM-650 TMA min 60
Thermal Stress IPC-TM-650 288℃, solder dip -- pass
Volume Resistivity IPC-TM-650 C-96/35/90 MΩ.cm 6.0 x 108
Surface Resistivity IPC-TM-650 C-96/35/90 8.0 x 107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 148
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 45+kV NB
Dissipation Constant (Dk) RC50%
IPC-TM-650 1GHz -- 4.30
Dissipation Factor (Df) RC50% IPC-TM-650 1GHz -- 0.010
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8
After thermal Stress 288℃,10s
N/mm 1.35
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 550
CW IPC-TM-650 2.4.4 A MPa 430
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.09
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0



1. All the typical value is based onthe 1.6mm (8*7628) specimen. The Dk and Df value is based on 50% RC.

2. All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.

Explanations:C=Humidity conditioning; D=Immersion conditioning in distilled water;E=Temperature conditioning.

The figures following the letter symbolsindicate with the first digit the duration of the preconditioning in hours,with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.