CN/EN

产品与市场

SF315C

特点

●  透明度低,遮光性佳。

●  粘结强度高,尺寸稳定性好。

●  阻燃性达到UL94 V-0级。

●  优秀的耐热性、耐化学性和电性能。

●  溢胶量低,加工性好,适于快速压合和传统压合。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

挠性印制电路板用覆盖膜
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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 0.71
288℃, 5s 0.7
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability SY Method After peeling off the paper
% -0.0304/-0.0151
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >85
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.1×108
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.2×105
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.5
Dissipation Factor (10GMHz) SPDR C-24/23/50
- 0.017
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125
Rating V-0

Remarks:

*Testing after laminating with shining side of copper foil in suitablecondition

1.Certified to IPC-4203/2 Epoxy adhesive on one or two sides of poyimidedielectric

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.