CN/EN

产品与市场

SF206B

特点

低介电常数,低传输损耗 。

与铜箔和PI具有良好的粘结性。

不含卤素,阻燃性达到 UL94 V-0 级。

优秀的耐热性、耐化学性和电性能。

加工性好,适用于传统压合工艺。

满足 RoHS 指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

高频多层印制板和刚挠多层印制板等用粘接膜
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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.1
288℃, 5s 1.1
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >90
Electric Strength
IPC-TM-650 2.5.6.2A
D-48/50+D-0.5/23
KV/mm
40.2
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.1×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
1.4×106
Dielectric Constant (10GHz) SPDR C-24/23/50 - 2.5
Dissipation Factor (10GHz) SPDR C-24/23/50 - 0.003
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability
UL94
E-24/125
Rating
V-0

Remarks:

*Testing after laminating with shining side of copper foil in suitablecondition.

1.Certified to IPC-4203/24 Unsupported  polyimide adhesive

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.