CN/EN

产品与市场

SF325B

特点

●  粘接强度高。

●  不含卤素,阻燃性达到UL94 VTM-0级。

●  优秀的耐热性、耐化学性和电性能。

●  优异的耐离子迁移性,不长枝状结晶。

●  溢胶量低,加工性好,适于快速压合和传统压合。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

应用领域

多层挠性印制板和刚挠性印制板等用粘接膜
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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 1.4
288℃, 5s 1.3
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % 96.2
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 8.0×107
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
8.5×106
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.4
Dissipation Factor (10GHz) SPDR C-24/23/50 - 0.017
Resin Flow IPC-TM-650 2.3.17.1 180℃/10+60s,100kg/cm2
mm <0.15
Flammability
UL94
E-24/125
Rating
VTM-0

Remarks:

*Testing after laminating with shining side of copper foil and PI film insuitable condition.

1.Certified to IPC-4203/20 Unsupportedpolyester adhesive

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.