CN/EN

产品与市场

Synamic 6GX

特点

● 低Dk/Df@10GHz: 3.73/0.005
● 更优异的耐热性,Td>400℃,T300>60min
● 更低的Z轴热膨胀系数,优异的通孔可靠性
● 更低的吸水率,优异的耐湿耐热性
● 无铅制程兼容

应用领域

● 超高速网络设备

● 服务器、交换机、存储、路由器、基站BBU等

● 高性能计算机

● 光通信产品

  • 产品性能
  • 产品证书
  • 资料下载

Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 170
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min >60
T300 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
s 100
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 31
After Tg ppm/℃ 205
50-260℃ % 2.2
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.87
2.5.5.5 (10GHz)
C-24/23/50
- 3.73
Dissipation Factor 
2.5.5.9 (1GHz)
C-24/23/50
- 0.0023
2.5.5.5 (10GHz)
C-24/23/50
- 0.0050
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm [lb/in] 0.9 [5.14]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.08
Flammability
UL94
C-48/23/50
Rating
V-0

Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.



Remarks:

Remarks:

1. All the typical value is based on 6*2116 (0.76mm) thickness specimen, not guarantee data.

2.All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.