产品与市场
SH260
特点
● Tg＞250℃ (TMA), Td＞405℃ (5% loss, TGA), T300＞60min● 极低Z-热膨胀系数[1.20% (50-260℃)]，优异的通孔可靠性
● 高的高温模量保持率和高温可靠性
● 韧性树脂体系，不含MDA
● 无铅无卤兼容，符合RoHS/WEEE要求
● 符合IPC 4101D/40/41要求
应用领域
● 老化筛选板
● 井下钻探
● 航空航天
● 其他有长期高温环境需求的PCB
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | ＞250 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 429 |
| T300 |
2.4.24.1 |
TMA |
min |
＞60 |
| CTE (Z-axis) | 2.4.24 | 50-260℃ (X/Y) | ppm/℃ | 12~15 |
| α1 (before Tg) | ppm/℃ | 45 | ||
| 50-260℃ | % | 1.20 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.12 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.007 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 7.45 x 107 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 4.79 x 107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 180 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 40.5 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm | 1.37 |
| Flexural Strength | 2.4.4 | A | MPa | 530 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
HB |
Remarks:
1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.